[TriEmbed] another Eagle problem

[Pete Soper]

Thanks, Brian. I'd tried the "thermals for vias" option without luck (it 
only relates to the vias). So when I made the pour polygons I had the 
wire size too small. Makes perfect sense.
-Pete

On 07/21/2016 09:59 PM, Brian via TriEmbed wrote:
> Update: I found the setting.
>
> It's actually not intuitive, but it's a setting on the polygon that 
> defines the pour.  Right-click an edge of the poly and select 
> Properties.  "Width" controls the thickness of the lines used to draw 
> the poly, which includes thermal relief connections.
>
> Answer found here (someone having the inverse problem; thermals being 
> too thick):
>
> http://electronics.stackexchange.com/questions/10087/weird-thermal-reliefs-in-eagle-pcb 
>
>
> Cheers,
> -B
>
> On 07/21/2016 04:38 PM, Brian via TriEmbed wrote:
>> That's called "thermal relief." I don't know offhand how to control it
>> in Eagle, but I'm sure there's a setting somewhere.
>>
>> On 07/21/2016 01:57 PM, Pete Soper via TriEmbed wrote:
>>> I have two designs using the same pad from the standard Eagle 
>>> "wirepad".
>>> With one design I get reasonable connection between a copper pour and
>>> the pad's plated hole, but with the other I get very skinny 
>>> connections.
>>> Here's an example of a good connection:
>>>
>>> Here's a bad connection:
>>>
>>> Can somebody give me a clue about what determines the width of these
>>> connections? ? I've perturbated every design rule, grid, and other
>>> parameter I could find while wondering what this feature might be 
>>> called
>>> to ask a question on a forum.
>>>
>>> Making a new design with this pad results in pours with 'good'
>>> connections. I'm trying to avoid redoing the whole thing from scratch.
>>>
>>> -Pete
>>>
>>>
>>>
>>>
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>>
>>
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>
>
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