[TriEmbed] another Eagle problem

[Brian]

Update: I found the setting.

It's actually not intuitive, but it's a setting on the polygon that 
defines the pour.  Right-click an edge of the poly and select 
Properties.  "Width" controls the thickness of the lines used to draw 
the poly, which includes thermal relief connections.

Answer found here (someone having the inverse problem; thermals being 
too thick):

http://electronics.stackexchange.com/questions/10087/weird-thermal-reliefs-in-eagle-pcb

Cheers,
-B

On 07/21/2016 04:38 PM, Brian via TriEmbed wrote:
> That's called "thermal relief." I don't know offhand how to control it
> in Eagle, but I'm sure there's a setting somewhere.
>
> On 07/21/2016 01:57 PM, Pete Soper via TriEmbed wrote:
>> I have two designs using the same pad from the standard Eagle "wirepad".
>> With one design I get reasonable connection between a copper pour and
>> the pad's plated hole, but with the other I get very skinny connections.
>> Here's an example of a good connection:
>>
>> Here's a bad connection:
>>
>> Can somebody give me a clue about what determines the width of these
>> connections? ? I've perturbated every design rule, grid, and other
>> parameter I could find while wondering what this feature might be called
>> to ask a question on a forum.
>>
>> Making a new design with this pad results in pours with 'good'
>> connections. I'm trying to avoid redoing the whole thing from scratch.
>>
>> -Pete
>>
>>
>>
>>
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>
>
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