[TriEmbed] Eagle device with DSOP Advance footprint

[Pete Soper]

Definitely pad on top as well as bottom:
http://www.businesswire.com/news/home/20150227005214/en/Toshiba-Launches-Low-Voltage-MOSFET-Series-Dual-sided-Cooling#.VY2PzmBdWjQ

-Pete
On 06/26/2015 01:38 PM, Shane Trent via TriEmbed wrote:
> Hey Gang!
>
> I want to layout a board using a FET with a DSOP Advance footprint. I 
> was getting ready to start building the new device in Eagle and 
> thought I would ask the group first. Does anyone have a part with this 
> footprint already defined that I could use as a starting point?
>
> http://toshiba.semicon-storage.com/info/lookup.jsp?pid=DSOP%20Advance&lang=en&region=apc
>
> Is that a marking area call-out on the top view or does this package 
> have thermal pads on both the top and bottom of the package?
>
> Thanks and have a great weekend!
>
> Shane
> -- 
> A blog about some of my projects. http://fettricks.blogspot.com/
>

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